- [Case]Test Socket Breakout Board2018/07/16/ 10:14
- Customer: Brazil Elcomp company Requirements: 1. pinout will be confirmed by the following pads,it is the 3.3V input voltage and GND. 2. The breakout device usage: For checking this two net pads value is good or not,and help them confirm th...
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- [Case]CQFP84 function test socket2018/07/16/ 10:14
- Test chip: CQFP84 package (HFQ package) The main function of this model chip is: synchronous sampling of 24-bit analog-to-digital converters. The chip is used in military-grade applications, mainly for drilling equipment, high temperature e...
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- [Industry news]What are the main tests for general IC testing?2018/07/10/ 16:54
- In general, IC testing mainly includes chip pin continuity test, leakage current test, some DC (directcurrent) test, functional test (functionaltest), Trimtest, depending on the chip type, there are some other tests, such as AD/DA. There will be some special test types.
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- [FAQ]How long is the average lifespan of our socket?2018/07/10/ 16:11
- A: The lifespan of probe-type socket differs from that of spring-type socket. The former can be used for 100,000-300,000 times, while the latter 10,000-100,000 times. For more details, please refer to the product specifications.
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- [FAQ]What’s the MOQ?2018/07/10/ 16:09
- A: 1PCS. Of course, the larger the quantity is, the lower the price will be.
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- [FAQ]What’s the delivery time?2018/07/10/ 16:03
- A: Spot goods will be delivered within 24 hours, while customized sockets in 7-15 days. In case of holidays, delivery shall be postponed.
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- [FAQ]What are the advantages of KZT products?2018/07/10/ 15:41
- Answer (A): Definitely yes. Our price is 1/3 lower than other brands. To be specific, we are the largest socket manufacturer in China, providing one package service from production, RD to sales; while our competitors are mostly agents.
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- [Company dynamic]Brief description of the BGA socket2018/07/10/ 15:20
- The BGA is a package in the IC that is typically used in memory chips to increase memory capacity by two to three times in the same volume. The BAG chip has a smaller volume, better heat dissipation and electrical performance than the TSOP ...
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