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eMCP221 TOP-OPEN down press socket adapter
eMCP221 TOP-OPEN down press socket adapter without PCB board flash memory data recovery burn-in test programming code
Product introduction
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1. Product use:Test block, the IC BGA221 chip test, data reading and writing -
2.Applicable package:BGA221 pin spacing 0.5mm -
3.Test stand:BGA221-0.5 -
4. Features: imported beryllium copper shrapnel, small resistance, good elasticity.
Specification size
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1.model:BGA221-.5 -
2.Pin spacing (mm):0.5 -
3. Foot position: 65 -
4. Chip size: 11.5*13
Product Specification and Dimension :
| Application | data recovery burn-in test programming |
| Condition | New |
Product image
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