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eMMC153/169 BGA153 BGA169 Burn in Socket
eMMC153/169 BGA153 BGA169 Burn in Socket Pin Pitch 0.5mm IC Body Size 12x16mm Clamshell Test Socket Adapter Data Recovery
Product Feature :
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Apply to eMMC of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc . -
Apply to BGA153 & BGA169 test -
eMMC data can be read and written fastly -
Accurate positioning on flat bottom pad and solder of eMMC -
Support flat bottom and solder ball testing . -
Technical support and datasheet are available if you need . -
we are the original manufacturer and welcome anyone to be our distribution agents -
Professional manufacturer in all kinds of IC chip testing sockets and adapters. -
More Quantities with LOWER PRICE! -
More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .
Specification and Dimension
| Type : | Test & Burn in Socket ( without pcb ) |
| Package : | eMMC 153/169 , BGA 153/169 |
| Pin Pitch : | 0.5 mm |
| Pin Count : | 30 pins |
| Applicable IC body size : | 12x16 mm,11.5x13mm , 12x18mm , 14x18mm |
| eMMC thickness : | 0.8mm - 1.5mm |
| Applicable borders limiter / frame guider as below : | Single size 11.5x13mm / Single size 12x16mm / Single size 12x18mm / Single size 14x18mm |
Tips:We're the original manufaturer , we can provide the lowest and competitive price , the shortest processing time is guaranteed ! ! !
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